Cart (Loading....) | Create Account
Close category search window
 

Anodic vacuum arc developed nanocrystalline Cu–Ni and Fe–Ni thin film thermocouples

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $31
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

5 Author(s)
Mukherjee, S.K. ; Department of Applied Physics, Birla Institute of Technology Mesra, Ranchi, Jharkhand 835215, India ; Sinha, M.K. ; Pathak, B.. ; Rout, S.K.
more authors

Your organization might have access to this article on the publisher's site. To check, click on this link:http://dx.doi.org/+10.1063/1.3257252 

This paper deals with the development of nanocrystalline Cu–Ni and Fe–Ni thin film thermocouples (TFTCs) by using ion-assisted anodic vacuum arc deposition technique. The crystallographic structure and surface morphology of individual layer films have been studied by x-ray diffraction and scanning electron microscopy, respectively. The resistivity, temperature coefficient of resistance, and thermoelectric power of as deposited and annealed films have been measured. The observed departure of these transport parameters from their respective bulk values can be understood in terms of intrinsic scattering due to enhanced crystallite boundaries. From the measured values of thermoelectric power and the corresponding temperature coefficient of resistance of annealed Cu, Ni, and Fe films, the calculated values of log derivative of the mean free path of conduction electrons at the Fermi surface with respect to energy (U) are found to be -0.51, 3.22, and -8.39, respectively. The thermoelectric response of annealed Cu–Ni and Fe–Ni TFTCs has been studied up to a maximum temperature difference of 300 °C. Reproducibility of TFTCs has been examined in terms of the standard deviation in thermoelectric response of 16 test samples for each pair. Cu–Ni and Fe–Ni TFTCs agree well with their wire thermocouple equivalents. The thermoelectric power values of Cu–Ni and Fe–Ni TFTCs at 300 °C are found to be 0.0178 and 0.0279 mVC, respectively.

Published in:

Journal of Applied Physics  (Volume:106 ,  Issue: 11 )

Date of Publication:

Dec 2009

Need Help?


IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2014 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.