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Intra- and inter-temperature measurement BIST for SiP module using digital frequency analyser circuit

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3 Author(s)
Han, C.H. ; Coll. of Electron. & Inf., Kyung Hee Univ., Yongin, South Korea ; Lee, J.-W. ; Hong, S.H.

A method and a novel circuitry for intra- and inter-chip temperature measurement in a system in a package (SiP) module is presented. The proposed built-in self-test (BiST) system for the SiP module features a newly proposed digital frequency analyser (DFA) that can be used to efficiently discern clock period differences of up to 1 ns. The full digital interface of the DFA enables power and area efficient temperature measurements in an SiP.

Published in:

Electronics Letters  (Volume:45 ,  Issue: 24 )