Referenced Items are not available for this document.
A method and a novel circuitry for intra- and inter-chip temperature measurement in a system in a package (SiP) module is presented. The proposed built-in self-test (BiST) system for the SiP module features a newly proposed digital frequency analyser (DFA) that can be used to efficiently discern clock period differences of up to 1 ns. The full digital interface of the DFA enables power and area efficient temperature measurements in an SiP.
Published in:
Electronics Letters
(Volume:45
,
Issue:
24
)
Date of Publication: November 19 2009
- Page(s):
- 1221 - 1223
- ISSN :
- 0013-5194
- INSPEC Accession Number:
- 10995629
- Digital Object Identifier :
- 10.1049/el.2009.2415
- Product Type:
- Journals & Magazines
- Date of Current Version :
- 08 December 2009
- Issue Date :
- November 19 2009
- Sponsored by :
- Institution of Engineering and Technology
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