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Ultrafast semiconductor thin disk lasers: Power scaling, wafer integration concept and optical versus electrical pumping

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1 Author(s)
Keller, U. ; Dept. of Phys., ETH Zurich, Zurich, Switzerland

This paper discusses the integration issues, the output power scaling and the potential for electrical pumping of modelocked integrated external-cavity surface emitting laser (MIXSEL) with semiconductor saturable absorber mirror (SESAM). The MIXSEL would be ideally suited for many applications where the current ultrafast laser technology is considered to be too bulky and expensive.

Published in:

LEOS Annual Meeting Conference Proceedings, 2009. LEOS '09. IEEE

Date of Conference:

4-8 Oct. 2009