By Topic

Validation studies of DELPHI-type Boundary-Condition-Independent Compact Thermal Model for an opto-electronic package

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

5 Author(s)
Raghupathy, A.P. ; Electron. Cooling Solutions, Inc., Santa Clara, CA, USA ; Aranyosi, A. ; Maltz, W. ; Ghia, U.
more authors

A boundary-condition-independent (BCI) compact thermal model (CTM) was generated for an opto-electronic transceiver package called SFP (small form-factor pluggable device). The SFP has four internal power dissipating sources and the BCI CTM for the SFP was developed using the DELPHI methodology. This paper presents a detailed validation of the BCI CTM of the SFP in real-time applications using Flotherm, a computational fluid dynamics (CFD)-based thermal analysis software package. The results show excellent agreement between the results predicted by the SFP CTM with the data from the detailed model and from the experiments. The SFP CTM predicts the junction temperature of the four power dissipating components and the heat flows through the sides with relative error less than 10%. In addition to accurate thermal characterization of the SFP, the SFP CTM facilitates a large order reduction (105 to 1) in the CFD-based computations. Advantages and limitations on using the DELPHI methodology for generation of CTM for the SFP are also discussed.

Published in:

Thermal Investigations of ICs and Systems, 2009. THERMINIC 2009. 15th International Workshop on

Date of Conference:

7-9 Oct. 2009