Cart (Loading....) | Create Account
Close category search window
 

Noise Isolation in Mixed-Signal Systems Using Alternating Impedance Electromagnetic Bandgap (AI-EBG) Structure-Based Power Distribution Network (PDN)

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

4 Author(s)
Jinwoo Choi ; IBM Syst. & Technol. Group, IBM Corp., Austin, TX, USA ; Govind, V. ; Swaminathan, M. ; Bharath, K.

This paper presents efficient noise isolation and suppression method in mixed-signal systems using alternating impedance electromagnetic bandgap (AI-EBG) structure-based power distribution network (PDN). Currently, split planes are used for isolation in mixed-signal systems for isolating sensitive RF/analog circuits from noisy digital circuits. However, split planes show good isolation only at low frequencies due to electromagnetic coupling through the gap. The AI-EBG structure-based PDN presented in this paper provides excellent isolation (-80 dB ~ -100 dB) in the frequency range of interest by suppressing almost all possible electromagnetic modes. The AI-EBG structure has been integrated into a mixed-signal test vehicle to demonstrate the isolation level achievable. The ability of the AI-EBG structure to suppress switching noise has been quantified in this paper. The AI-EBG structure provided greater than 100 dB of isolation in passive S-parameter measurement and suppressed in-band noise down to -88 dBm of isolation in a functional test.

Published in:

Advanced Packaging, IEEE Transactions on  (Volume:33 ,  Issue: 1 )

Date of Publication:

Feb. 2010

Need Help?


IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2014 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.