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IR-DROP Analysis and Thermal Assessment of Planar Electromagnetic Bandgap Structures for Power Integrity Applications

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3 Author(s)
De Paulis, F. ; Dept. of Electr. Eng., Univ. of L''Aquila, L''Aquila, Italy ; Raimondo, L. ; Orlandi, A.

This paper investigates the relationship among the high-frequency performances of a planar electromagnetic bandgap structure for power integrity applications and its static (dc) behavior. The IR-Drop and the thermal performances are accurately investigated through 3-D simulations. Measurements of the high-frequency electromagnetic properties and of the temperature variation are also performed for validating the models employed in the analysis.

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Advanced Packaging, IEEE Transactions on  (Volume:33 ,  Issue: 3 )