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Advanced COPNA-resin as a low temperature curing resin for high-density electronic packages

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3 Author(s)
Nawa, K. ; Res. & Dev. Center, Sumitomo Metals Technol. Ltd., Hyogo, Japan ; Ueda, S. ; Watanabe, H.

A novel type of low temperature curing resin for both LSI packages and high-density electronic packages was synthesized. The resin, named advanced COPNA-resin, was synthesized from naphthalene and 1,4-benzenedimethanol under an acid catalyst. The resin could be cured at lower temperature than generally used polyimide resin by more than 100°C. Beside the property of low temperature curing, the new resin exhibited attractive properties as an electronic insulating material of LSI packages and high-density packages: high glass transition temperature (250°C), low dielectric constant (εr3.1 for 1 MHz frequency), and small water absorption (0.37 wt.%). The resin could form thin films at the film thickness range from 5 to 20 μm when the spin speed range was from 1000 to 5000 rpm. The obtained thin films exhibited sufficient planarity in practical uses, and a precisely patterning property by a plasma etching method. In this paper, we also carried out the analysis for reaction process of the B-staged advanced COPNA-resin by using infrared absorption spectroscopy and 13C-NMR spectroscopy

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Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging, IEEE Transactions on  (Volume:19 ,  Issue: 3 )