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Modeling, measurement, and simulation of simultaneous switching noise

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2 Author(s)
McCredie, B.D. ; IBM Corp., Poughkeepsie, NY, USA ; Becker, W.D.

The computer package designer depends on modeling power supply noises to ensure that system designs will function properly. Power supply noises can have a tremendous effect on system operation and performance. The circuit simulation of a system power distribution is very challenging since it requires accurate models of active devices, passive components, transmission lines, and a very large power distribution network. This paper presents the development of a high-frequency power distribution model for the simulation of simultaneous switching noise of a complementary metal-oxide-semiconductor (CMOS) chip on a multilayered ceramic substrate. Measurements are performed on a CMOS chip with simultaneously switching off-chip drivers (OCD's). The modeling approach is validated by the excellent agreement between the measurement waveforms and simulation results

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Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging, IEEE Transactions on  (Volume:19 ,  Issue: 3 )