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Accelerated frequency domain analysis by susceptance-element based model order reduction of 3D full-wave equations

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3 Author(s)
Narayanan, T.V. ; Interconnect & Packaging Center, Georgia Inst. of Technol., Atlanta, GA, USA ; Sung-Hwan Min ; Swaminathan, M.

A circuit-equivalent frequency-domain three-dimensional electromagnetic simulation for package structures is proposed. A robust and passive susceptance-element based model order reduction is applied to the governing equation for accelerated simulation and proof-of-concept is shown with the examples of power-ground structure simulations.

Published in:

Electrical Performance of Electronic Packaging and Systems, 2009. EPEPS '09. IEEE 18th Conference on

Date of Conference:

19-21 Oct. 2009