By Topic

Thin polyimide films for dielectric interlayer application

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

4 Author(s)
Damaceanu, M. ; Petru Poni Inst. of Macromolecular Chem., Iasi, Romania ; Rusu, R. ; Bruma, M. ; Müller, A.

Thin films based on siloxane-containing polyimides have been prepared by the drop-casting technique. These films with thickness of tens of micrometers were flexible and resisted to repeated bendings. Very thin films having the thickness in the nanometer range, with neat surface, without pinholes or cracks, were obtained, as well. The mechanical and dielectric properties of these polyimide films were measured and discussed.

Published in:

Semiconductor Conference, 2009. CAS 2009. International  (Volume:2 )

Date of Conference:

12-14 Oct. 2009