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Planarised interconnection technology using a new pillar formation method with multistacked metal structure

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5 Author(s)

A multilevel interconnection technology using both a new pillar structure consisting of multi-stacked metal layers and chemical-mechanical polishing planarisation has been proposed. This has several advantages such as self-aligned interconnection and decreased via-pillar resistance. The via-pillar resistance becomes one third of conventional via. In addition this method can improve the planarisation capability of inter-metal dielectrics

Published in:

Electronics Letters  (Volume:32 ,  Issue: 18 )