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Power, interface, and integration: handset chipset design issues

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3 Author(s)
Tae Hee Han ; Sungkyunkwan Univ., Suwon, South Korea ; Jae-chern Yoo ; Hyunseok Lee

In this work, we address key design aspects of mobile wireless terminal chipsets with practical examples. Significant expansions in capability, in conjunction with market demands for compactness, reasonable price and longer battery life, place substantial pressure on handset component technologies. To achieve these mutually conflicting goals with available implementation technologies, specialized design skills are necessary for power saving, chip-to-chip interface and subsystem integration in mobile phone chipsets. The inter-related design and verification issues are discussed with lessons learned from our professional experiences in designing third-generation cellular modems, mobile digital TV, and mobile WiMax system-on-a-chip development.

Published in:

Communications Magazine, IEEE  (Volume:47 ,  Issue: 11 )