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The following topics are dealt with: copper through silicon vias; die-to-wafer direct bonding and planarization; MEMS-LSI multi-chip module; high energy physics; 3D-integrated circuit technology; multi-processor network-on-chip; and NAND flash memories.

Published in:

3D System Integration, 2009. 3DIC 2009. IEEE International Conference on

Date of Conference:

28-30 Sept. 2009

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