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3D integrated circuits for lab-on-chip applications

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3 Author(s)
Samuel J. Dickerson ; Department of Electrical and Computer Engineering, University of Pittsburgh, PA, U.S.A. ; Steven P. Levitan ; Donald M. Chiarulli

We present the designs of two new lab-on-chip devices that use 3D integrated circuit technology to support the separation, purification, and assay of biological particles. Our technique is based on a nanoscale implementation of dielectrophoresis. The key feature of our designs is the use of fabrication features found in 3D technology to create on-chip, nanoscale electrode arrays. The capabilities of our designs are demonstrated with multi-physics simulations of the chips sorting heterogeneous mixtures of HSV-1 capsids.

Published in:

3D System Integration, 2009. 3DIC 2009. IEEE International Conference on

Date of Conference:

28-30 Sept. 2009