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Browse Conference Publications > 3D System Integration, 2009. ... Help

Development of Functionally innovative 3D-Integrated Circuit (Dream Chip) technology / High-Density 3D-Integration Technology for Multifunctional Devices

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1 Author(s)
Kada, M. ; 3D-Integration Technol. Res. Dept., Assoc. of Super-Adv. Electron. Technol., Tokyo, Japan

In the NEDO ldquoDream Chip Projectrdquo, ASET has been entrusted a project for developing, ldquoHigh-Density 3D-Integration Technology for Multifunctional Devicesrdquo. In the five year project from 2008 to 2012, development on technologies for design environment, interposer, chip test, cooling and stacking/bonding, thin wafer, and development on demonstration device and process are being performed.

Published in:
3D System Integration, 2009. 3DIC 2009. IEEE International Conference on

Date of Conference: 28-30 Sept. 2009

Page(s):
1 - 6
E-ISBN :
978-1-4244-4512-7
Print ISBN:
978-1-4244-4511-0
INSPEC Accession Number:
10943278
Conference Location :
San Francisco, CA
Digital Object Identifier :
10.1109/3DIC.2009.5306596
Product Type:
Conference Publications

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