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Evaluation of energy-recovering interconnects for low-power 3D stacked ICs

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4 Author(s)
Asimakopoulos, P. ; Sch. of EECE, Newcastle Univ., Newcastle upon Tyne, UK ; Van der Plas, G. ; Yakovlev, A. ; Marchal, P.

Energy-recovering schemes have been proposed in the literature as an alternative approach to low-power design, while their performance has been demonstrated to be extremely promising when driving large capacitive loads, such as clock distribution networks. This work investigates the potential of the energy-recovering methodology for improving the energy efficiency of through-silicon via (TSV) interconnects in 3D ICs.

Published in:

3D System Integration, 2009. 3DIC 2009. IEEE International Conference on

Date of Conference:

28-30 Sept. 2009