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Thin wafer handling — Study of temporary wafer bonding materials and processes

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1 Author(s)
Hermanowski, J. ; SUSS MicroTec, Inc., Waterbury Center, VT, USA

This paper reviews the major adhesives and processes used for 3D TSV thin wafer handling, provides thermal and other performance data on the materials and processes and attempts to establish a first order estimate of process related thermal performance using a common analytical method.

Published in:

3D System Integration, 2009. 3DIC 2009. IEEE International Conference on

Date of Conference:

28-30 Sept. 2009