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Low Cost of Ownership scalable copper Direct Bond Interconnect 3D IC technology for three dimensional integrated circuit applications

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5 Author(s)
Enquist, P. ; Ziptronix, Inc., Morrisville, NC, USA ; Fountain, G. ; Petteway, C. ; Hollingsworth, A.
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This paper presents preliminary results of a copper-based direct bond interconnect (DBIreg) 3D integration process that has been developed to leverage foundry standard copper dual damascene and Ziptronix bond technology to achieve scalable, very low Cost-of-Ownership, 3D interconnects with minimum foundry adoption barrier. Results achieved include 100% operable arrays of 72,500 3D copper DBIreg interconnections on a 25 micron pitch with a 125degC thermal budget and 10 micron pitch 3D copper DBIreg interconnections with a 350degC thermal budget. DBIreg contact resistance and resistivity achieved are < 50 mOhm / connection and < 0.45 Ohm-um2, respectively, using three or four micron diameter Cu DBIreg plugs and a TiW barrier layer. Reliability results include bare die that pass temperature cycling and HAST JEDEC tests.

Published in:

3D System Integration, 2009. 3DIC 2009. IEEE International Conference on

Date of Conference:

28-30 Sept. 2009