Cart (Loading....) | Create Account
Close category search window

Hybrid Large-Signal/Lumped-Element Electro-Thermal Modeling of GaN-HEMTs

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

4 Author(s)
Bertoluzza, F. ; Dept. of Inf. Eng., Univ. of Parma, Parma, Italy ; Sozzi, G. ; Delmonte, N. ; Menozzi, R.

This paper shows a practical approach to GaN-based HEMT self-consistent electro-thermal simulation for circuit modeling and reliability estimation. A physical-level lumped element dynamic thermal network able to describe the 2-D device geometry is self-consistently coupled with a novel electro-thermal compact large-signal model. The results obtained with the lumped-element thermal network are compared with finite-element simulations and shown to provide valuable estimates of the thermal behavior of very large 2-D structures. Measured results taken at ambient temperatures between 200 and 400 K are shown to be well described by the model.

Published in:

Microwave Theory and Techniques, IEEE Transactions on  (Volume:57 ,  Issue: 12 )

Date of Publication:

Dec. 2009

Need Help?

IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2014 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.