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QC-Fill: Quick-and-Cool X-Filling for Multicasting-Based Scan Test

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2 Author(s)
Chao-Wen Tzeng ; Dept. of Electr. Eng., Nat. Tsing-Hua Univ., Hsinchu, Taiwan ; Shi-Yu Huang

This paper presents an X-fill scheme that properly utilizes the don't-care bits in test patterns to simultaneously reduce the test time as well as the test power (including both capture power and shifting power). This scheme, called Quick-and-Cool X-fill (QC-Fill), built upon the multicasting-based scan architecture, further leverages on the merits of previous low-capture-power X-fill methods through techniques like multicasting-driven X-fill and clique stripping. QC-Fill is independent of the automatic test pattern generation patterns and does not require any extra area overhead. Experimental results demonstrate that this scheme strikes a good balance between the seemingly conflicting criteria of low power and test compression.

Published in:

Computer-Aided Design of Integrated Circuits and Systems, IEEE Transactions on  (Volume:28 ,  Issue: 11 )

Date of Publication:

Nov. 2009

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