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Substrate noise problems in a system-on-a-chip hamper the smooth cohabitation between analog and digital circuitries on the same die. Solving those problems will shorten the time to market. This paper presents a methodology that gives designers the necessary insight to solve this substrate noise problem. The methodology combines the strengths of the electromagnetic simulator, the parasitic extractor, and the circuit simulator. Its main assets are the ease of use, an acceptable simulation time, and a good accuracy. Moreover, this methodology does not need doping profiles that are hard to get hold off. The proposed methodology is demonstrated on two challenging examples: a 48-53-GHz LC voltage-controlled oscillator and a dc-to-5-GHz wideband receiver designed, respectively, in a 0.13-mum and a 90-nm CMOS technology. The substrate noise coupling mechanisms are revealed for both examples in a simulation time of less than 2 hours. The methodology is successfully validated by measurements performed on real-life prototypes of those examples with an accuracy of 1-2 dB.