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Room-Temperature Sealing of Microcavities by Cold Metal Welding

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5 Author(s)
Decharat, A. ; Microsyst. Technol. Lab., R. Inst. of Technol., Stockholm, Sweden ; Junchun Yu ; Boers, M. ; Stemme, G.
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In this paper, we present a wafer-to-wafer attachment and sealing method for wafer-level manufacturing of microcavities using a room-temperature bonding process. The proposed attachment and sealing method is based on plastic deformation and cold welding of overlapping metal rings to create metal-to-metal bonding and sealing. We present the results from experiments using various bonding process parameters and metal sealing ring designs including their impact on the resulting bond quality. The sealing properties against liquids and vapor of different sealing ring structures have been evaluated for glass wafers that are bonded to silicon wafers. In addition, wafer-level vacuum sealing of microcavities was demonstrated when bonding a silicon wafer to another silicon wafer with the proposed room-temperature sealing and bonding technique.

Published in:

Microelectromechanical Systems, Journal of  (Volume:18 ,  Issue: 6 )

Date of Publication:

Dec. 2009

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