Referenced Items are not available for this document.
Contact spring deflection occurs with environmental temperature change or Joule heating due to current flow, causing a microscopic slide of the contact point and sometimes so-called fretting corrosion. To analyze the microscopic deformation due to thermal stress, a holographic pattern measuring system (HPMS) that combines holography and graphic image processing has been developed for measuring the contact point displacement in a noncontact way. The HPMS was applied to a thermally deformed contact spring, and the distribution was shown automatically as a three-dimensional graphic image. For an electric contact thermally excited by current flow, a quantitative correlation between the slide of the contact point and the thermal deformation of the spring was obtained, and some irregularity in contact voltage was found. From the deformation analysis the relationship between the contact voltage and the deformation of the spring due to current flow was made clear
Published in:
Components, Hybrids, and Manufacturing Technology, IEEE Transactions on
(Volume:13
,
Issue:
1
)
Date of Publication: Mar 1990
- Page(s):
- 20 - 26
- ISSN :
- 0148-6411
- INSPEC Accession Number:
- 3700277
- Digital Object Identifier :
- 10.1109/33.52879
- Product Type:
- Journals & Magazines
- Date of Current Version :
- 06 August 2002
- Issue Date :
- Mar 1990
- Sponsored by :
- IEEE Components, Packaging, and Manufacturing Technology Society
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