By Topic

Brazing to low-temperature-fired thick films

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

1 Author(s)
Keusseyan, R.L. ; Dupont Electron., Research Triangle Park, NC, USA

The development of materials and processes for brazing leads, pins, and heat sinks to alumina ceramic substrates is presented. The substrates are metallized using either copper-, silver-, or gold-based thick-film pastes that are fired in the 850-950°C temperature range. The metal ceramic joint strengths obtained are comparable to those achieved using high-temperature fired tungsten- or molybdenum-based metallizations

Published in:

Components, Hybrids, and Manufacturing Technology, IEEE Transactions on  (Volume:13 ,  Issue: 1 )