By Topic

High speed wavelength conversion in a heterogeneously integrated disc laser over silicon on insulator for network on a chip applications

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$33 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

6 Author(s)
O. Raz ; Eindhoven University of Technology, Den Dolech 2, 5600MB, The Netherlands ; L. Liu ; D. Van Thourhout ; P. Rojo-Romeo
more authors

We present the first BER results for wavelength conversion at 2.5 Gb/s for an InP membrane micro-disc-laser bonded on SOI substrate. Measured BER supports error-free operation when FEC is used. Operation at 10 GB/s is also demonstrated.

Published in:

2009 35th European Conference on Optical Communication

Date of Conference:

20-24 Sept. 2009