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Opportunities and Challenges for 3D Systems and Their Design

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2 Author(s)
Emma, P. ; T.J. Watson Res. Center, IBM, Yorktown Heights, NY, USA ; Kursun, E.

This article presents the system design opportunities offered by 3D integration, and it discusses the design and test challenges for 3D ICs, with various new design-for-manufacture and DFT issues.

Published in:

Design & Test of Computers, IEEE  (Volume:26 ,  Issue: 5 )