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Fabrication of 3-dimensional silicon microelectrode arrays using micro electro discharge machining for neural applications

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4 Author(s)
Tathireddy, P. ; Dept. of Electr. & Comput. Eng., Univ. of Utah, Salt Lake City, UT, USA ; Rakwal, D. ; Bamberg, E. ; Solzbacher, F.

Ultra high aspect ratio microelectrodes are designed and fabricated to record and stimulate neural signals from deeper areas of the brain and nerves and also to provide a new research tool to the neuroscience community. We present a fabrication process to build ultra high aspect ratio silicon based microelectrode arrays for the neural applications. The mu-wire electrical discharge machining (mu-WEDM) process enables machining electrodes from highly conductive bulk silicon. The electrodes are electrically isolated near their base by glass. Thin, needleshaped and smooth silicon microelectrodes are realized with an optimized chemical etching process.

Published in:

Solid-State Sensors, Actuators and Microsystems Conference, 2009. TRANSDUCERS 2009. International

Date of Conference:

21-25 June 2009

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