Skip to Main Content
This paper presents a novel miniaturized overload resistant piezoresistive silicon high-pressure sensor for a pressure range up to 500 MPa. The novel composite element is made of a solid body silicon chip with implanted piezoresistive resistors. A solid body glass substrate is jointed to the silicon by anodic bonding. The operating mode is based on mechanical strain of all-round pressurized silicon and mechanical mismatched substrate. This paper also presents the verification of the functionality on the basis of repeatable metrological investigations with 200 MPa of experimental designs and analytical investigations as well as finite element analysis.