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A wafer design problem in semiconductor manufacturing for reliable customer service

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3 Author(s)
Singh, M.R. ; Graduate Sch. of Ind. Adm., Carnegie-Mellon Univ., Pittsburgh, PA, USA ; Abraham, C.T. ; Akella, R.

The authors present models that explicitly take account of yield losses and show how available chip sites should be allocated among various types of chips to meet the demand of a set with the maximum probability. A key result is that the proportion of sites allocated to each chip type varies with the total number of available sites. The allocation model also provides a tradeoff curve between the total number of chip sites assigned for the production of a set and the highest attainable level of confidence in meeting the demand; this is valuable when more than one set is competing for the same resources. The influence of wafer loss and rework on the determination of job size is considered. The models presented here are particularly useful when reliable delivery of a set of chips by an impending due date is of prime concern and the fabrication line is congested

Published in:

Components, Hybrids, and Manufacturing Technology, IEEE Transactions on  (Volume:13 ,  Issue: 1 )

Date of Publication:

Mar 1990

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