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System on chip with 1.12mW-32Gb/s AC-coupled 3D memory interface

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7 Author(s)
Canegallo, R. ; STMicroelectronics, Agrate, Italy ; Perugini, L. ; Pasini, A. ; Innocenti, M.
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An AC-coupled 3D memory interface for chip-to-chip communication is implemented in 90 nm CMOS technology. It transfers 128 bit words between stacked SRAMs in an ARM-based System on Chip (SoC) platform at 250 MHz. This interface requires 0.05 mm2 of occupation area and achieves a 32 Gbit/sec of throughput and an average energy consumption of 35 muW/Gbit/sec.

Published in:

Custom Integrated Circuits Conference, 2009. CICC '09. IEEE

Date of Conference:

13-16 Sept. 2009