By Topic

Improving Side-Effect Analysis with Lazy Access Path Resolving

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

3 Author(s)
Ju Qian ; Coll. of Inf. Sci. & Technol., Nanjing Univ. of Aeronaut. & Astronaut., Nanjing, China ; Yuming Zhou ; Baowen Xu

For scalability, many side-effect analysis methods choose inclusion-based context-insensitive (IBCI) pointer analysis as their basis. However, such a pointer analysis is known to be imprecise, which often results in over-conservative side-effect sets. In this paper, we present a lightweight approach that exploits lazy access path resolving to improve the precision of side-effect analysis under IBCI pointer analysis. The approach partly represents and propagates side-effects in the access path form with the help of interstatement must aliases. All access paths can finally be resolved to the accessed locations, but during the side-effect propagation phase, an access path will never be resolved as long as it could be mapped to another access path in the caller. Since in inclusion-based points-to analysis, points-to sets of variables in the callers tend to be smaller than the ones in the callees, such lazy resolving mechanism can lead to more precision. The experimental results show that the lazy access path resolving approach is effective in improving the precision of IBCI pointer analysis based side-effect analysis methods.

Published in:

Source Code Analysis and Manipulation, 2009. SCAM '09. Ninth IEEE International Working Conference on

Date of Conference:

20-21 Sept. 2009