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Designing “dual personality” IEEE 1149.1 compliant multi-chip modules

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1 Author(s)
Jarwala, N. ; Eng. Res. Center, AT&T Bell Labs., Princeton, NJ, USA

The IEEE 1149.1 Test Access Port and Boundary-Scan Architecture Standard can be used at many different levels in the integration hierarchy of a product. However there is one level where using the standard poses some difficulty. This is multi-chip modules (MCM). This paper explores the problem and proposes a set of solutions for different classes of MCMs

Published in:

Test Conference, 1994. Proceedings., International

Date of Conference:

2-6 Oct1994

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