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Development of a 3 dimensional package for pressure sensors

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1 Author(s)
Metasch, R. ; Electron. Packaging Lab., Tech. Univ. Dresden, Dresden, Germany

There will be presented a concept for a tower-assembling-technology, which is particularly suitable for pressure sensors of the aeronautical and aerospace due to their high thermal and mechanical cycling stability. The developed vertical assembly is to be produced sequentially and offers the opportunity of a bus system. Through this bus system there can be maintained supply and signal lines. The assembling was tested in a test of changing temperature. In this test there was used a four point resistor measurement in order to monitor all electrical and mechanical contacts of the construction.

Published in:

Electronics Technology, 2008. ISSE '08. 31st International Spring Seminar on

Date of Conference:

7-11 May 2008