By Topic

Life-time of lead-free soldered SMT joints

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

2 Author(s)
Szwech, M. ; Div. of Precision & Electron. Product Technol., Warsaw Univ. of Technol., Warsaw, Poland ; Drozd, Z.

The work concern the life-time of electronic products according to ROHS Directive of European Community. Methods and results of accelerated mechanical and thermal cycling fatigue tests of SnPb and lead-free solder joints, realized in GreenRoSE EC Project are described. The aim of the work is development of cheap test methods, applicable by small producers of electronic equipment. Thermal shock cycling method and mechanical method of cycling bending of PCB samples with soldered SMT and BGA components were applied. The investigations showed the possibility of simplified reliability assessment of lead-free electronic products by mechanical fatigue testing. Advantage of this method is lower cost and shorter test time as by thermal cycling. The planes of further research for obtaining more detailed data are discussed.

Published in:

Electronics Technology, 2008. ISSE '08. 31st International Spring Seminar on

Date of Conference:

7-11 May 2008