By Topic

Life-time test of laser and reflow soldered flexible substrates

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

2 Author(s)
Batorfi, R. ; Dept. of Electron. Technol., Budapest Univ. of Technol. & Econ. (BME), Budapest, Hungary ; Illyefalvi-Vitez, Z.

We examined the quality and the reliability of lead-free solder joints which were made with a selective laser soldering process. The three types of applied substrate materials - polyimide (PI), a kind of polyester (PET) and polyethylene-naphtalate (PEN) - withstood the local heat dose even if the allowed temperature limits of them were lower than the melting points of the applied solders. We used substrates with different adhesives and cover layers. The two types of solder pastes were SnBi and SnAgCu (SAC) alloys. Altogether 16 solder-substrate-adhesive combinations were tested and compared to similar reflow soldered combinations when the implementation of the technology was possible. The testboards were submitted to HAST (highly accelerated stress test) and the degradation was monitored. Optical inspection and shear force measurements were used for comparative analyses. As a result, the combinations were put in order on the basis of these data. With these achievements; the processing, materials, product performance and reliability could be improved.

Published in:

Electronics Technology, 2008. ISSE '08. 31st International Spring Seminar on

Date of Conference:

7-11 May 2008