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Analysis of glue die-attach integrity of IC packages is typically performed by Acoustic Microscope in transmission mode (THRU-SCAN). THRU-SCAN mode can easily detect delamination at die-attach (D.A.) interface but is not able to define which is the interface delaminated. D.A. delamination could be located at die-pad/glue or at glue/die interface. In failure analysis it is important to fix the delaminated interface, to discover the failure mode and understand the root cause. Up to now this analysis has been performed by cross sections with uncertain results and waste of time and money. An analysis method using reflection mode has been developed in ldquoCPA AGRATE stress analysis labrdquo to detect and fix D.A. delamination in exposed pad packages with glue D.A. Acoustic microscope used for this trial is a SONOSCAN D9000; package test vehicle is a TQFP14x14-Ep.