By Topic

Fine die-attach delamination analysis by scanning acoustic microscope

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$33 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

2 Author(s)
G. Santospirito ; ST Microelectronics Via C.Olivetti 2, Agrate Brianza- Milano Italy ; A. Terzoli

Analysis of glue die-attach integrity of IC packages is typically performed by Acoustic Microscope in transmission mode (THRU-SCAN). THRU-SCAN mode can easily detect delamination at die-attach (D.A.) interface but is not able to define which is the interface delaminated. D.A. delamination could be located at die-pad/glue or at glue/die interface. In failure analysis it is important to fix the delaminated interface, to discover the failure mode and understand the root cause. Up to now this analysis has been performed by cross sections with uncertain results and waste of time and money. An analysis method using reflection mode has been developed in ldquoCPA AGRATE stress analysis labrdquo to detect and fix D.A. delamination in exposed pad packages with glue D.A. Acoustic microscope used for this trial is a SONOSCAN D9000; package test vehicle is a TQFP14x14-Ep.

Published in:

Microelectronics and Packaging Conference, 2009. EMPC 2009. European

Date of Conference:

15-18 June 2009