Skip to Main Content
3D integration and configurations based on More than Moore approaches are becoming very popular in recent years. The first applications that could use this breakthrough technology are making more and more sense for implementation in the next generations of cellular phones. This paper gives explanations on what is 3D Integration and divides this denomination into 2 main categories: 3D at the packaging level and 3D at the IC level. Presentations of R&D efforts in both categories are given in order to illustrate the main differences. Insights about the complementarities of 3D ICs with some latest advanced packaging solutions such as Fan-Out Wafer Level Packaging are discussed. Finally, a global roadmap of applications that may use these advanced solutions is shown with respective challenges and timeframes.
Date of Conference: 15-18 June 2009