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MuCCRA-cube is a scalable three dimensional dynamically reconfigurable processor. By stacking multiple dies connected with inductive-coupling links, the number of PE array can be increased so that the required performance is achieved. A prototype chip with 90 nm CMOS process consisting of four dies each of which has a 4 times 4 PE array was implemented. The vertical link achieved 7.2Gb/s/chip, and the average execution time is reduced to 31% compared to that using a single chip.
Date of Conference: Aug. 31 2009-Sept. 2 2009