Referenced Items are not available for this document.
MuCCRA-cube is a scalable three dimensional dynamically reconfigurable processor. By stacking multiple dies connected with inductive-coupling links, the number of PE array can be increased so that the required performance is achieved. A prototype chip with 90 nm CMOS process consisting of four dies each of which has a 4 times 4 PE array was implemented. The vertical link achieved 7.2Gb/s/chip, and the average execution time is reduced to 31% compared to that using a single chip.
Published in:
Field Programmable Logic and Applications, 2009. FPL 2009. International Conference on
Date of Conference: Aug. 31 2009-Sept. 2 2009
- Page(s):
- 6 - 11
- ISSN :
- 1946-1488
- E-ISBN :
- 978-1-4244-3892-1
- Print ISBN:
- 978-1-4244-3892-1
- INSPEC Accession Number:
- 10893681
- Conference Location :
- Prague
- Digital Object Identifier :
- 10.1109/FPL.2009.5272565
- Product Type:
- Conference Publications
About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies
A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2013 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.
