By Topic

Hands-On Summer Camp to Attract K–12 Students to Engineering Fields

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

4 Author(s)
Yilmaz, M. ; Electr. Eng. & Comput. Sci. Dept., Texas A&M Univ. - Kingsville, Kingsville, TX, USA ; Jianhong Ren ; Custer, S. ; Coleman, J.

This paper explains the organization and execution of a summer engineering outreach camp designed to attract and motivate high school students as well as increase their awareness of various engineering fields. The camp curriculum included hands-on, competitive design-oriented engineering projects from several disciplines: the electrical, environmental, mechanical, civil, and chemical engineering fields. The camp also provided additional information on financial aid, the academic programs in the fields of science, technology, engineering, and math (STEM) offered at Texas A&M University-Kingsville (TAMUK), as well as various career options for prospective engineers. The implementation of the camp activities and the well-designed hands-on projects not only increased the students' satisfaction, but also improved their self-confidence and their interest toward engineering disciplines. The engineering outreach camp survey results clearly indicated the success of the camp and the effectiveness of the hands-on, competitive engineering design experiences to attract students to engineering professions. Thus, it demonstrated an effective, feasible, and sustainable engineering recruitment approach.

Published in:

Education, IEEE Transactions on  (Volume:53 ,  Issue: 1 )