By Topic

Wafer-Scale hermetically packaged MEMS switches with liquid gallium contacts

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$33 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

1 Author(s)
Qingquan Liu ; Micro/Nano Electron. Res. Team, Nanjing Univ. of Inf. Sci. & Technol., Nanjing, China

A wafer-scale hermetically packaged self-healing RF MEMS switch, which utilizes liquid gallium (Ga) contacts to take the place of the traditional solid metal contacts, is proposed in this paper. Liquid Ga contact switch features significantly improved power handling capability compared to conventional MEMS switches. The switch is driven by an electrostatic actuator, which includes upper electrodes on a silicon nitride bridge and lower electrodes on the substrate. Small liquid Ga droplets serve as a self-healing interface between the upper and lower contact electrodes. To minimize RF loss, a quartz wafer is used as the substrate material. To prevent oxidation of the liquid gallium, a hermetical packaging process with frit glass seal is used. A pyrex glass cap wafer is connected to the quartz device wafer by the frit glass seal. Finite element analysis is used to simulate the electro-thermal heating of the package. The measured package leakage rate is below 1 Torr/year.

Published in:

Electronic Packaging Technology & High Density Packaging, 2009. ICEPT-HDP '09. International Conference on

Date of Conference:

10-13 Aug. 2009