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Recent advances in laser assisted polymer intermediate layer bonding for MEMS packaging

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3 Author(s)
Changhai Wang ; School of Engineering & Physical Sciences, Heriot Watt University, Edinburgh EH14 4AS, UK ; Jun Zeng ; Yufei Liu

This paper presents the recent advances in the development of a laser assisted fast polymer bonding method for electronic packaging applications. In this method a high power diode laser is used to cure a polymer adhesive material to bond substrates together. A unique beam forming method using custom designed optical phase plate elements was developed to transform a fiber delivered laser beam into top-hat and frame shaped beam profiles for energy efficient polymer bonding for electronics manufacturing. In addition it has been found that the frame shaped beam profile can produce a desirable temperature distribution for MEMS packaging in which the surface temperature at the center of the substrate is lower by ~50degC than the packaging temperature (~300degC) when bonding a glass cap to a silicon substrate. An accurate temperature monitoring method using an embedded thin film microsensor array has been developed and has been used successfully for process monitoring. Defect-free fast bonding (~10 seconds) of transparent cap (glass) and non-transparent cap (silicon) to a silicon chip has been demonstrated. This work illustrates the potential of the diode laser based photonic technology for advanced MEMS packaging and electronics manufacturing.

Published in:

Electronic Packaging Technology & High Density Packaging, 2009. ICEPT-HDP '09. International Conference on

Date of Conference:

10-13 Aug. 2009