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Artificial neural network application in vertical interconnection modeling

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2 Author(s)
Yuanjun Liang ; Shenzhen Institute of Advanced Integration Technology Chinese Academy of Sciences/The Chinese University of Hong Kong 1068 Xueyuan Avenue, Shenzhen University Town, Nanshan District, China ; Lei Li

This paper proposes a neural network-based method for modeling vertical interconnect balls. The pi equivalent circuit with lumped element was used to characterize the electrical performance of balls. The values of lumped elements were extracted from the full-wave simulate result, and the extracted data was used to train back-propagation (BP) neural networks to obtain the relationship between the lumped element values and the physical size of the balls. Then this model was used to estimate the electrical character of ball with other layout parameters.

Published in:

Electronic Packaging Technology & High Density Packaging, 2009. ICEPT-HDP '09. International Conference on

Date of Conference:

10-13 Aug. 2009