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Moiré method for nanoprecision wafer-to-wafer alignment: Theory, simulation and application

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2 Author(s)
Chenxi Wang ; School of Engineering, the University of Tokyo 7-3-1 Hongo, Bunkyo-ku, Tokyo, 113-8656, Japan ; Tadatomo Suga

The two dimensional (2D) moireacute centrosymmetric grating is developed to assist realization of high-precision wafer-to-wafer alignment and non-destructive measurement of misalignments for wafer bonding. Using these moireacute patterns the misalignments in the order of plusmn 64 nm in X-Y axis can be resolved by a simple IR microscopy (5times objective) images. This value can be further improved to sub-10 nm range if the sub-pixel estimation is performed. For current status, the limit of the minimum resolved misalignment using moireacute gratings is ~0.2 nm according to theoretical analysis. It can be applied for not only the future 3D integration of wafer-scale, but also the fabrication of 3D nanostructures and advanced lithography techniques.

Published in:

Electronic Packaging Technology & High Density Packaging, 2009. ICEPT-HDP '09. International Conference on

Date of Conference:

10-13 Aug. 2009