Cart (Loading....) | Create Account
Close category search window
 

Wetting behaviour of lead free solder on electroplated Ni and Ni-W alloy barrier film

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

3 Author(s)
Chew, C.S. ; Dept. of Mech. Eng., Univ. of Malaya, Kuala Lumpur, Malaysia ; Haseeb, A.S.M.A. ; Johan, M.R.

In this work, electrodeposited Ni-W alloys were studied as barrier films between Cu substrate and lead free Sn3.8Ag0.7Cu (SAC387) solder. Wetting angle and spreading rate of SAC387 on Ni-W alloys with different tungsten contents were investigated and compared with that on Ni film deposited from Watt's bath. Ni-W alloy films of about 1.5 to 2.5 mum were deposited from ammonia-citrate bath on copper substrate. Results show solder/Ni-W alloy system and solder/Ni system exhibited almost the same spreading rate and wetting angle. The wetting angle does not change significantly with tungsten content in the range of 11.3 to 18.0 at.%. Metallographic observation reveals that while intermetallic compound on Ni is continuous, that on Ni-W alloy film is discontinuous.

Published in:

Electronic Packaging Technology & High Density Packaging, 2009. ICEPT-HDP '09. International Conference on

Date of Conference:

10-13 Aug. 2009

Need Help?


IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2014 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.