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Quality and reliability challenges for ultra mobile computing and communication application processor packaging

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2 Author(s)
Dongming He ; Quality & Reliability Eng., Intel Corp., Folsom, CA, USA ; Wonjae Kang

Market drivers, technology scaling and integration trends of application processor packaging are first presented. Component level and board level quality and reliability challenges are then discussed in the areas of thin die and thin core package warpage, lead free flip chip die to package interconnect mechanical integrity, and lead free package to motherboard solder joint reliability. Challenges from package qualification methodology and use condition are also addressed.

Published in:

Electronic Packaging Technology & High Density Packaging, 2009. ICEPT-HDP '09. International Conference on

Date of Conference:

10-13 Aug. 2009