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Browse Journals & Magazines > Radio and Electronic Engineer ...> Volume:44 Issue:9 Help

Thick film techniques for hybrid integrated microwave circuits

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2 Author(s)
Funk, W. ; Philips GmbH, Forschungslaboratorium Hamburg, Hamburg, West Germany ; Schilz, W.

The applicability of thick film technique has been investigated for frequencies above 1 GHz. By usinga special technique (direct metal foil screens) integrated microwave circuits for frequencies up to 10 GHz have been fabricated. The special requirements for microwave thick film circuits are discussed and the electrical and technological properties of three selected microwave circuits are reported in detail.

Published in:
Radio and Electronic Engineer  (Volume:44 ,  Issue: 9 )

Date of Publication: September 1974

Page(s):
504 - 508
ISSN :
0033-7722
Digital Object Identifier :
10.1049/ree.1974.0124
Product Type:
Journals & Magazines
Date of Current Version :
26 January 2010
Issue Date :
September 1974

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