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Abstract - 3D integration offers a new paradigm - in addition to Moore’s Law - for improving areal circuit density. It also comes with a very new set of considerations. These are mostly logistical advantages that enable different ways of thinking about, and composing systems from subsystem components. In essence, it affords a direct physical manifestation of the age-old ASICs concept of the reuse of IP blocks. But with these new opportunities come some completely new considerations for a feasible design, test, and burn-in flow. Most of the considerations involving 3D design and test start with choosing an appropriate via structure and placement. After that, it is necessary to design layers that will be testable both before and after final assembly. We suggest how that is best and most easily accomplished. A very new set of considerations and tools required are thermal analysis tools. Ironically, it is horizontal heat flow that is nearly as important as vertical heat flow in a 3D stack. Throughout this article, we discuss the various new DFM/DFT issues and opportunities for 3D systems.