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Package stacking, die stacking, wafer stacking, and device stacking are the four different types of three dimensional (3D) technology. Except for package stacking, the other three stacking techniques require special considerations when designing circuits and systems. In this paper, different stacking techniques will first be reviewed, followed by an introduction to the possible applications for 3D circuits and systems, including sensor systems, processor-memory systems, Network-on-Chip designs, and Field-Programmable Gate Arrays. The paper will also provide key design considerations in 3D circuits and systems, and use a sensor system as an example to summarize 3D design issues discussed.