Cart (Loading....) | Create Account
Close category search window
 

Large-signal modeling and characterization of a plastic packaged HBT for use in wireless portable units

Sign In

Cookies must be enabled to login.After enabling cookies , please use refresh or reload or ctrl+f5 on the browser for the login options.

Formats Non-Member Member
$31 $13
Learn how you can qualify for the best price for this item!
Become an IEEE Member or Subscribe to
IEEE Xplore for exclusive pricing!
close button

puzzle piece

IEEE membership options for an individual and IEEE Xplore subscriptions for an organization offer the most affordable access to essential journal articles, conference papers, standards, eBooks, and eLearning courses.

Learn more about:

IEEE membership

IEEE Xplore subscriptions

2 Author(s)
Wu, Der‐Woei ; Corp. Res. & Dev. Centre, M/A-COM Inc., Lowell, MA, USA ; Henderson, G.N.

A method is presented for the extraction of an accurate large-signal model for plastic-packaged GaAs HBTs. The packaged device model is extracted by a combination of DC and small-signal on-wafer characterization of the chip device and small-signal characterization of short and open package structures through on-wafer probing of ceramic launchers to the package. The technique has been applied to M/A-COM's 32-finger HBT in an SOT-89 package; the resulting model shows excellent agreement with large-signal measurements for the packaged device, predicting the power and gain within 0.5 dB for a wide range of input power drive and device biases

Published in:

Electrical Performance of Electronic Packaging, 1995

Date of Conference:

2-4 Oct 1995

Need Help?


IEEE Advancing Technology for Humanity About IEEE Xplore | Contact | Help | Terms of Use | Nondiscrimination Policy | Site Map | Privacy & Opting Out of Cookies

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2014 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.