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Large-signal modeling and characterization of a plastic packaged HBT for use in wireless portable units

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2 Author(s)
Wu, Der‐Woei ; Corp. Res. & Dev. Centre, M/A-COM Inc., Lowell, MA, USA ; Henderson, G.N.

A method is presented for the extraction of an accurate large-signal model for plastic-packaged GaAs HBTs. The packaged device model is extracted by a combination of DC and small-signal on-wafer characterization of the chip device and small-signal characterization of short and open package structures through on-wafer probing of ceramic launchers to the package. The technique has been applied to M/A-COM's 32-finger HBT in an SOT-89 package; the resulting model shows excellent agreement with large-signal measurements for the packaged device, predicting the power and gain within 0.5 dB for a wide range of input power drive and device biases

Published in:

Electrical Performance of Electronic Packaging, 1995

Date of Conference:

2-4 Oct 1995