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3D finite element analysis and experiment on the piezoelectric ultrasonic transducer motion

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3 Author(s)
Fu-Sheng Hsiao ; Dept. of Mechatron. Eng., Nat. Changhua Univ. of Educ., Changhua, Taiwan ; Jen-Ai Chao ; Yi-Cheng Huang

Investigating the displacement motion of the piezoelectric ultrasonic transducers plays an important role for bonding process in package technology. Mechanical vibration and electrical performance analysis of the transducer is a great concern. The commercial 3D ATILA software is used for simulation first. Best resonance frequency of the transducer is verified and tested via LCR impedance meter and laser Doppler velocity meter experimentally. Both 3D finite element simulation and experimental results reach similar transducer's tip motion behavior for future study.

Published in:
Mechatronics and Automation, 2009. ICMA 2009. International Conference on

Date of Conference: 9-12 Aug. 2009

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